Introducing our newly shipped RF PCB, specifically designed for high-frequency applications and built using the advanced F4BM220 material. This cutting-edge printed circuit board combines polytetrafluoroethylene resin, polytetrafluoroethylene film, and glass fiber cloth through a meticulous manufacturing process. With its exceptional electrical performance, the F4BM220 RF PCB offers a wider range of dielectric constant, low dielectric loss, increased insulation resistance, and enhanced stability compared to its predecessor, F4B. It serves as an excellent substitute for similar foreign products.
Crafted with forward rotating ED copper foil for cladding, the F4BM220 RF PCB is specifically tailored for applications that do not require PIM (Passive Intermodulation) indicators, ensuring optimal performance for RF systems.
The F4BM220 series laminates employ a precise adjustment of the dielectric constant by modifying the ratio between polytetrafluoroethylene and glass fiber cloth. This technique not only achieves low loss but also enhances the dimensional stability of the material. As the dielectric constant increases, the proportion of glass fiber also increases, resulting in improved dimensional stability, a lower coefficient of thermal expansion, better temperature fluctuation performance, and increased dielectric loss.
Data sheet of PTFE
| Name | Test condition | Unit | Value |
| Density | Normal state | g/ cm3 | 2.1～2.35 |
| Moisture Absorption | Dip in the distilled water of 20±2℃ for 24 hours | % | ≤0.02 |
| Operating Temperature | High-low temperature chamber | ℃ | -50℃～+260℃ |
| Thermal Conductivity | | W/m/k | 0.8 |
| CTE (typical) | 0～100℃ (εr :2.1~2.3) | ppm/℃ | 25(x) |
| 34(y) |
| 252(z) |
| CTE (typical) | 0～100℃ (εr :2.3~2.9) | ppm/℃ | 14(x) |
| 21(y) |
| 173(z) |
| CTE (typical) | 0～100℃ (εr :2.9~3.5) | ppm/℃ | 12(x) |
| 15(y) |
| 95(z) |
| Shrinkage Factor | 2 hours in boiling water | % | 0.0002 |
| Surface Resistivity | 500V DC | Normal state | M·Ω | ≥1×104 |
| Constant humidity and temperature | ≥1×103 |
| Volume Resistivity | Normal state | MΩ.cm | ≥1×106 |
| Constant humidity and temperature | ≥1×105 |
| Pin Resistance | 500V DC | Normal state | MΩ | ≥1×105 |
| Constant humidity and temperature | ≥1×103 |
| Surface dielectric strength | Normal state | d=1mm(Kv/mm) | ≥1.2 |
| Constant humidity and temperature | ≥1.1 |
| Dielectric Constant | 10GHZ | εr | 2.20,2.55,2.65,3.0,3.5 (±2%) |
| Dissipation Factor | 10GHZ | tgδ | 2.2 | ≤7×10-4 |
| 2.55~2.65 | ≤1×10-3 |
| 3.0~3.5 | ≤1.5×10-3 |
Key Features:
- Dielectric constant of 2.2 with a tight tolerance of 0.04 at 10 GHz/23°C.
- Ultra-low loss tangent of 0.001 at 10 GHz.
- Temperature coefficient of dielectric constant (TCDk) of -142 ppm/°C.
- Moisture absorption rate of 0.08%.
- Coefficient of thermal expansion (CTE) in the X-axis of 25 ppm/°C, Y-axis of 34 ppm/°C, and Z-axis of 240 ppm/°C.
Key Benefits:
- Superior signal integrity due to the low loss tangent.
- Diversified size options and cost savings.
- Excellent resistance to irradiation and low exhaust.
- Ready for commercialization, mass production, and offers high cost performance.
PCB Specifications:
This RF PCB is a 2-layer rigid PCB with the following stackup:
- Copper Layer 1: 35 μm
- F4BM220: 1.524 mm (60 mil)
- Copper Layer 2: 35 μm
| PCB Material: | Fibre glass coated PTFE |
| Code: | F4BM-1/2 (family series) |
| Dielectric constant: | 2.2, 2.55, 2.65, |
| | 3.0 and 3.5 |
| Layer count: | 1 Layer, 2 Layers and multi-layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.25mm, 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm,3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Silver, OSP,etc. |
To meet the demands of RF applications, this PCB has a board dimension of 392mm x 256mm (1 piece) with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 7/6 mils and a minimum hole size of 0.3mm. This PCB has a finished board thickness of 1.6mm and a finished copper weight of 2oz (2.8 mils) for the outer layers. The via plating thickness is 20 μm. It features an immersion gold surface finish and does not include top or bottom silkscreen or solder mask. To ensure quality, every PCB undergoes a 100% electrical test before shipment.
Applications:
This PCB is specifically designed for high-frequency applications, making it ideal for various RF systems, including microwave, radar, and satellite communications. It is well-suited for use in phase shifters, passive components, power dividers, couplers, combiners, feed networks, phased array antennas, and base station antennas.
Experience exceptional electrical performance and reliability with the F4BM220 RF PCB. Its innovative design, low loss, and enhanced stability make it the perfect choice for demanding RF applications in a wide range of industries.
Product Tags:
|
|
60mil F4BM220 High Frequency PCB Double Sided Immersion Gold Circuit Images
|
