Introduction:
It's very happy to introduce our newly shipped PCB which made of RO4003C laminates. RO4003C laminates are cost-effective microwave materials known for their precise control over dielectric constant (ε) and low loss. They are available in different configurations, utilizing 1080 and 1674 glass fabric styles. Unlike PTFE-based microwave materials, RO4003C laminates do not require special handling procedures or through-hole treatments. These laminates are non-brominated and do not have a UL 94 V-0 rating.
Features:
RO4003C laminates are composed of woven glass reinforced hydrocarbon/ceramics. They have a dielectric constant (DK) of 3.38 ± 0.05 at 10 GHz and a dissipation factor (tan δ) of 0.0027 at the same frequency. The laminates exhibit a thermal conductivity of 0.71 W/m/°K. The coefficient of thermal expansion (CTE) is 11 ppm/°C in the X-axis, 14 ppm/°C in the Y-axis, and 46 ppm/°C in the Z-axis. The glass transition temperature (Tg) is greater than 280 °C, and the laminates can operate within a temperature range of -40℃ to +85℃.
| RO4003C Typical Value |
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Benefits:
RO4003C laminates offer excellent electrical performance with low dielectric tolerance and low loss. They maintain stable electrical properties across a wide frequency range. The laminates exhibit a low thermal coefficient of dielectric constant, providing dimensional stability. They also offer reliable plated through holes with low Z-axis expansion. With a low in-plane expansion coefficient, RO4003C laminates remain stable over a range of circuit processing temperatures. Moreover, these laminates are cost-effective compared to conventional microwave laminates. They are also resistant to conductive anodic filamentation (CAF).
PCB Stackup:
This PCB is a 2-layer rigid construction, the stackup consists of a 35 μm copper layer on the top, a 0.813 mm (32 mil) RO4003C core, and another 35 μm copper layer on the bottom.
PCB Construction Details:
The dimensions for this PCB.It's two types of the design. The size are 265mm x 66.88mm with a tolerance of +/- 0.15mm. The minimum trace/space is 6/5 mils, and the minimum hole size is 0.35mm. The PCB does not have blind vias, and the finished board thickness is 0.9mm. The outer copper layer weight is 1 oz (1.4 mils), and the via plating thickness is 20 μm. The surface finish is immersion gold, while the top and bottom silkscreens are white. The solder masks are green on both sides. A 100% electrical test is conducted prior to shipment.
PCB Statistics:
This PCB consists of 66 components and has a total of 153 pads, including 81 through-hole pads and 72 top surface mount technology (SMT) pads. The PCB does not have bottom SMT pads. It includes 120 vias and 4 nets.
Supplied Artwork Type and Quality Standard:
The supplied artwork type is Gerber RS-274-X, and the quality standard is IPC-Class-2.
Availability:
This PCB made of RO4003C laminates are available worldwide.
Typical Applications:
RO4003C laminates are commonly used in cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNBs (Low Noise Block downconverters) for direct broadcast satellites.
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0.813mm 2L RF PCB Made Of RO4003C Laminates For High Frequency Applications Images
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