Introducing the RO3203 High Frequency Circuit PCB, engineered for superior performance in demanding applications. This advanced 4-layer rigid PCB utilizes Rogers RO3203 ceramic-filled laminates, known for their exceptional electrical performance and mechanical stability. With a dielectric constant of 3.02 and a dissipation factor of just 0.0016, this PCB is designed to excel in high-frequency environments exceeding 40 GHz.
Key Features
High-Performance Material: Constructed from Rogers RO3203 ceramic-filled PTFE composites, ensuring a robust and reliable design.
Excellent Dielectric Properties: Dielectric constant of 3.02 ± 0.04 at 10 GHz and a low dissipation factor of 0.0016 at 10 GHz, ideal for high-frequency applications.
Thermal Stability: Withstanding temperatures over 500°C and featuring a thermal conductivity of 0.87 W/mK.
Low Coefficient of Thermal Expansion: Matched to copper, ensuring reliable performance in hybrid designs.
Lead-Free Compatibility: Compliant with modern environmental standards, including 94V-0 flammability rating.
| RO3203 Typical Value |
| Property | RO3203 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.02±0.04 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Dissipation Factor,tanδ | 0.0016 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Conductivity | 0.47 (3.2) | | W/mK | Float 100℃ | ASTM C518 |
| Volume Resistivity | 107 | | MΩ.cm | A | ASTM D257 |
| Surface Resistivity | 107 | | MΩ | A | ASTM D257 |
| Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
| Tensile Modulus | | X Y | kpsi | RT | ASTM D638 |
| Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
| Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
| Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
| Moisure Absorption | <0.1 | | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
| Td | 500 | | ℃ | TGA | ASTM D3850 |
| Density | 2.1 | | gm/cm3 | 23℃ | ASTM D792 |
| Copper Peel Stength | 10 (1.74) | | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-Free Process Compatible | Yes | | | | |
PCB stack-up
The RO3203 PCB features a 4-layer rigid construction that incorporates the following layers:
Copper Layer 1: 35 μm
Rogers RO3203 Substrate: 10 mil (0.254mm)
Copper Layer 2: 35 μm
Prepreg FR-28: Enhances the structural integrity of the PCB
This layered construction allows for efficient signal routing, thermal management, and mechanical stability, making it suitable for complex multi-layer high-frequency structures.
Manufacturing Attributes
Board Dimensions: 49.6mm x 25.2mm
Minimum Trace/Space: 4/6 mils, enabling fine line etching for high-density applications.
Finished Board Thickness: 0.6mm, ideal for compact designs.
Surface Finish: Immersion Gold, providing excellent solderability and corrosion resistance.
Robust Testing Standards for Quality Assurance
Every RO3203 PCB undergoes a 100% electrical test prior to shipment, adhering to IPC-Class-2 standards. This rigorous testing ensures that each board meets the highest quality specifications, empowering the next generation of designs.
Applications Across Industries: Where RO3203 Excels
From automotive collision avoidance systems to wireless telecommunications, the RO3203 PCB is versatile across various applications. Its robust construction makes it ideal for microstrip patch antennas, direct broadcast satellites, and more, driving efficiency in manufacturing.
The Benefits of Using Rogers RO3203 Materials
One of the standout features of the RO3203 is its woven glass reinforcement, which enhances rigidity for easier handling. This ensures excellent dimensional stability, resulting in high production yields and a cost-effective solution for high-volume manufacturing.
Future Trends in High-Frequency Electronics
As industries continue to evolve, the demand for reliable, high-performance PCBs will only increase. The RO3203 PCB positions itself as a leader in this field, ready to meet future challenges with its innovative design and robust specifications.
Conclusion: Embracing the Future with RO3203
The RO3203 High Frequency Circuit PCB is more than a circuit board; it is a comprehensive solution that empowers engineers and manufacturers alike. With its unmatched electrical performance, thermal stability, and cost-effectiveness, the RO3203 is set to revolutionize high-frequency applications. Embrace the future of technology with confidence—choose the RO3203 PCB for your next project.
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4-layer RO3203 PCB 0.6mm Immersion Gold Finished Images
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