Introducing the Rogers RO4350B 4-Layer Rigid PCB, designed for superior functionality in demanding applications. This high-performance printed circuit board is constructed using Rogers RO4350B materials, which are known for their unique blend of woven glass reinforced hydrocarbon/ceramics. Exceptional electrical performance is offered, comparable to PTFE, combined with the manufacturability of epoxy/glass.
Key Electrical Properties
The electrical characteristics of RO4350B are particularly noteworthy:
Dielectric Constant (Dk): With a value of 3.48 ±0.05 at 10GHz, this material ensures stable performance across a wide frequency range, making it suitable for high-frequency applications.
Dissipation Factor: The low dissipation factor of 0.0037 at 10GHz indicates minimal signal loss, which is crucial for maintaining signal integrity in RF and microwave applications.
Thermal Conductivity: At 0.69 W/m/°K, RO4350B provides excellent thermal management, enabling effective heat dissipation in high-power circuits.
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Advantages Over Conventional Materials
Cost-Effectiveness
One of the standout benefits of Rogers RO4350B is its cost-effectiveness. It is priced competitively compared to conventional microwave laminates while providing similar or superior performance. This affordability allows for significant savings in large-scale manufacturing without compromising quality.
Dimensional Stability
The thermal coefficient of expansion (CTE) of RO4350B material closely matches that of copper. This compatibility results in outstanding dimensional stability, a critical factor for multi-layer boards where different materials may expand and contract at varying rates.
CTE Values:
X-axis: 10 ppm/°C
Y-axis: 12 ppm/°C
Z-axis: 32 ppm/°C
High Thermal Stability
With a glass transition temperature (Tg) exceeding 280°C (536°F), RO4350B maintains its structural integrity and electrical performance across a wide range of processing temperatures. This high thermal stability is especially beneficial in applications subject to high thermal stress.
Detailed PCB Construction
The Rogers RO4350B 4-Layer Rigid PCB features a carefully designed stackup that maximizes performance:
Stackup Configuration:
Copper Layer 1: 35 μm
Rogers RO4350B Core: 0.762 mm (30 mil)
Copper Layer 2: 35 μm
Prepreg RO4450F: 0.102 mm (4 mil)
Copper Layer 3: 35 μm
Rogers RO4350B Core: 0.762 mm (30 mil)
Copper Layer 4: 35 μm
Manufacturing Precision
Precision manufacturing techniques ensure minimal trace and space widths of 4/7 mils and a minimum hole size of 0.3 mm. This level of detail is essential for high-density designs and ensures reliability in complex circuit layouts.
Quality Assurance and Testing
All PCBs undergo rigorous quality assurance processes, adhering to IPC-Class-2 standards. Each board is subjected to a 100% electrical test prior to shipment, ensuring that only fully functional products reach the customer. This commitment to quality minimizes the risk of failures in the field and enhances customer satisfaction.
Typical Applications
The versatility of the Rogers RO4350B 4-Layer Rigid PCB makes it suitable for a wide array of applications, including:
Cellular Base Station Antennas: Providing robust performance in communication systems.
RF Identification Tags: Enabling reliable tracking and identification.
Automotive Radar and Sensors: Supporting advanced driver-assistance systems (ADAS) and safety features.
LNBs for Direct Broadcast Satellites: Ensuring high-quality signal reception and processing.
Conclusion
The Rogers RO4350B 4-Layer Rigid PCB represents a significant advancement in PCB technology, combining cost-effectiveness with high-performance characteristics. Its robust electrical properties, excellent dimensional stability, and high thermal resistance make it an ideal choice for a variety of demanding applications. As the electronics industry continues to innovate, this PCB stands out as a reliable solution for engineers and designers seeking quality and performance in their projects.
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