In an era where high-frequency applications are becoming increasingly critical, the demand for reliable and innovative circuit board solutions has never been greater. Rogers RO4003C High Frequency PCB, a groundbreaking product designed to meet the rigorous demands of RF microwave circuits, matching networks, and controlled impedance transmission lines. This article delves into the features, benefits, applications, and significance of the RO4003C PCB, showcasing its potential to transform the landscape of high-frequency electronics.
Understanding RO4003C: A New Era of Circuit Board Materials
The RO4003C is crafted from proprietary woven glass reinforced hydrocarbon/ceramics, presenting a unique blend of the electrical performance characteristics of PTFE/woven glass with the manufacturability of epoxy/glass. This innovative construction results in a low-loss material that meets the needs of high-frequency applications while maintaining cost-effectiveness in circuit fabrication.
Key Features of RO4003C
Dielectric Performance: The RO4003C boasts a dielectric constant of 3.38 ± 0.05 at 10 GHz, which minimizes signal distortion and allows for enhanced transmission quality. This is particularly advantageous for applications where signal integrity is paramount.
Low Dissipation Factor: With a dissipation factor of 0.0027 at 10 GHz, the RO4003C ensures efficient signal propagation, making it ideal for high-frequency environments where conventional circuit board laminates fall short.
Thermal Stability: This PCB exhibits a thermal conductivity of 0.71 W/m/°K and a glass transition temperature (Tg) exceeding 280 °C. Such characteristics enable the RO4003C to withstand high operational temperatures without compromising performance.
Controlled Coefficients of Thermal Expansion (CTE): The material features a CTE matched to copper, with values of 11 ppm/°C (X-axis) and 14 ppm/°C (Y-axis). This ensures minimal thermal stress on components, enhancing reliability in hybrid designs.
Low Moisture Absorption: With a moisture absorption rate of only 0.06%, the RO4003C is resistant to environmental factors that can degrade performance over time.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
PCB Construction and Specifications
This 4-layer rigid PCB stackup of the RO4003C is meticulously designed for optimal performance in high-frequency applications. Key construction details include:
Board Dimensions: 65 mm x 65 mm ± 0.15 mm
Minimum Trace/Space: 7/8 mils, allowing for high-density designs.
Finished Board Thickness: 4.8 mm, providing robustness for various applications.
Surface Finish: ENEPIG, which enhances solderability and corrosion resistance.
This construction ensures that the RO4003C is well-equipped to handle the demands of advanced electronic systems.
Applications
The RO4003C High Frequency PCB is ideal for a wide range of applications, including:
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point to Point Digital Radio Antennas
Availability
The RO4003C High Frequency PCB is available worldwide and adheres to IPC-Class-2 standards. This PCB is a reliable choice for engineers and manufacturers seeking high-performance solutions for their RF microwave circuits and matching networks.
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4-layer RO4003C PCB 4.8mm Multilayer Circuit with ENEPIG Images
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