Introducing our newly shipped 6-layer PCB, constructed using advanced RO4003C and S1000-2M materials. This PCB is engineered for high-frequency applications, making it an ideal choice for industries such as telecommunications, aerospace, and defense.
Introduction to RO4003C Material
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics designed to provide superior high-frequency performance with a low cost of circuit fabrication. This low-loss material can be manufactured using standard epoxy/glass (FR-4) processes, allowing for competitive pricing.
Key properties of RO4003C include:
- Dielectric Constant: 3.38 ± 0.05 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Conductivity: 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C, operating between -50°C to 150°C
- CTE Matched to Copper: X-axis at 11 ppm/°C, Y-axis at 14 ppm/°C
- Low Z-axis Coefficient of Thermal Expansion: 46 ppm/°C
- Tg: >280 °C
- Low Moisture Absorption: 0.06%
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Features of S1000-2M Material
The S1000-2M material enhances the PCB's performance with the following features:
- Lower Z-Axis CTE: Improves through-hole reliability.
- Excellent Mechanical Processability: Ensures compatibility with various manufacturing processes.
- Thermal Resistance: High heat resistance, with a Tg of 180 °C.
- Lead-Free Compatibility: Suitable for eco-friendly applications.
- Excellent Anti-CAF Performance: Protects against conductive anodic filament issues.
- Low Water Absorption: Enhances durability in humid conditions.
PCB Stack-Up
The PCB stack-up is designed for optimal performance:
- Copper Layer 1: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 2: 35 μm
- Prepreg (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 3: 35 μm
- S1000-2M Core: 0.203 mm (3 mil)
- Copper Layer 4: 35 μm
- Prepreg (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 5: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 6: 35 μm
Construction Details
- Board Dimensions: 62.5 mm x 57.8 mm (± 0.15 mm)
- Minimum Trace/Space: 4/7 mils
- Minimum Hole Size: 0.3 mm
- Finished Board Thickness: 1.1 mm
- Finished Copper Weight: 1 oz (1.4 mils) for inner/outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Silver
- Top Silkscreen: White
- Bottom Silkscreen: None
- Top Solder Mask: Matt Blue
- Bottom Solder Mask: Matt Blue
- Impedance Control: 90 Ohm on 4 mil / 7 mil traces/gaps on the top layer
- Via Specifications: 0.3 mm vias filled and capped
- Testing: 100% electrical testing performed prior to shipment
Artwork and Standards
The artwork is supplied in the Gerber RS-274-X format, ensuring compatibility with standard manufacturing processes. The PCB meets IPC-Class-2 standards, guaranteeing moderate reliability suitable for various applications.
Availability
This PCB is available worldwide, making it an accessible solution for engineers and designers across multiple industries.
Typical Applications
This versatile PCB is suitable for a range of high-frequency applications, including:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point-to-Point Digital Radio Antennas
Conclusion
The newly shipped 6-layer RO4003C + S1000-2M PCB is designed to deliver exceptional performance for high-frequency applications, combining advanced materials and precise engineering. For further inquiries or to place an order, you are encouraged to contact us today. Your projects deserve the best, and we are here to provide unparalleled support and solutions.
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Hybrid PCB On RO4003C And S1000-2M Materials 6-layer 1.1mm Thick Images
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