RF-10 PCBs are advanced composites of ceramic-filled PTFE and woven fiberglass, designed for high-performance RF applications. Offering a high dielectric constant and low dissipation factor, RF-10 provides exceptional dimensional stability and ease of handling for multilayer circuits.
Key Features:
Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/mk (Unclad)
CTE: x 16 ppm/°C, y 20 ppm/°C, z 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: V-0
Benefits:
High DK for RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance
High thermal conductivity for enhanced thermal management
Strong adhesion to smooth coppers
Low X, Y, Z expansion
Excellent price/performance ratio
| RF-10 Typical Values |
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | | 10.2 ± 0.3 | | 10.2 ± 0.3 |
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | | 0.0025 | | 0.0025 |
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
| Flammability Rating | Internal | | V-0 | | V-0 |
This PCB features a precise stackup configuration comprising Copper_layer_1 and Copper_layer_2 each measuring 35μm (1oz) in thickness, sandwiching the RF-10 Core layer at 25 mil (0.635mm). With a board size of 163.9mm x 104.9mm ± 0.15mm, the PCB maintains a minimum trace/space of 4/4 mils for optimal signal integrity and component spacing.
Mechanically, this PCB offers a minimum hole size of 0.5mm and a finished board thickness of 0.75mm, ensuring structural stability and flexibility during installation. The copper weight of 1oz (1.4 mils) on the outer layers, along with a 20 μm via plating thickness, supports efficient signal transmission and secure interconnections between layers.
It is finished with Immersion Tin for enhanced solderability and protection against oxidation. A white top silkscreen aids in component identification, while a green top solder mask provides environmental protection. Rigorous 100% electrical testing before shipment guarantees quality and adherence to design specifications, ensuring reliable performance in diverse applications.
The artwork format for this PCB follows the industry-standard Gerber RS-274-X format, ensuring compatibility with common design tools and manufacturing processes. Adhering to the IPC-Class-2 quality standard, the PCB meets stringent criteria for manufacturing and assembly, guaranteeing reliable performance in various applications.
With availability worldwide, the RF-10 PCB offers global accessibility for projects and industries requiring high-performance RF solutions.
Applications:
Microstrip Patch Antennas
GPS Antennas
Passive Components (filters, couplers, power dividers)
Aircraft Collision Avoidance Systems
Satellite Components
| PCB Material: | Composites of Ceramic Filled PTFE and Woven Fiberglass |
| Designation: | RF-10 |
| Dielectric constant: | 10.2 |
| Dissipation Factor | 0.0025 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Product Tags:
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25mil RF-10 PCB Double-Sided 1OZ Copper Immersion Tin Finished Images
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